The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Jun. 29, 2020
Applicant:

Autodesk, Inc., San Francisco, CA (US);

Inventors:

Abhishek Trivedi, Pleasant Hill, CA (US);

Bhupendra Lodhia, Stevenage, GB;

Gonzalo Martinez, Novato, CA (US);

Assignee:

Autodesk, Inc., San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/40 (2017.01); F16D 65/12 (2006.01); B29C 64/386 (2017.01); B33Y 80/00 (2015.01); F16D 65/02 (2006.01); B33Y 50/00 (2015.01); F16D 65/847 (2006.01);
U.S. Cl.
CPC ...
F16D 65/128 (2013.01); B29C 64/386 (2017.08); B29C 64/40 (2017.08); B33Y 50/00 (2014.12); B33Y 80/00 (2014.12); F16D 65/847 (2013.01); F16D 2065/132 (2013.01); F16D 2065/1328 (2013.01); F16D 2250/0007 (2013.01);
Abstract

Methods, systems, and apparatus, including medium-encoded computer program products, for designing lattice structures for heat dissipating devices include a method including: obtaining a 3D model of a device that passes a fluid through an internal structure of the device, including a lattice for the internal structure; performing computational fluid dynamics simulation using the 3D model to generate fluid turbulence data that indicates fluid flows through the lattice for the internal structure; modifying a first density in accordance with the fluid turbulence data; performing computational structural simulation using the 3D model and defined loading condition(s) for the device to generate structural integrity data that indicates a structural weakness of the device; modifying a second density in accordance with the structural integrity data; and providing the 3D model of the device, the 3D model including the modified first density and the modified second density.


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