The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Jun. 07, 2016
Applicant:
Avery Dennison Corporation, Glendale, CA (US);
Inventors:
Josh M. Bogner, Mentor, OH (US);
Dong-Tsai Hseih, Arcadia, CA (US);
Assignee:
Avery Dennison Corporation, Mentor, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/38 (2018.01); B24B 37/22 (2012.01); C08K 3/04 (2006.01); C08K 5/435 (2006.01); C09J 11/04 (2006.01); C09J 133/08 (2006.01); C09J 167/00 (2006.01); C09J 175/02 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
C09J 7/38 (2018.01); B24B 37/22 (2013.01); C08K 3/04 (2013.01); C08K 5/435 (2013.01); C09J 11/04 (2013.01); C09J 133/08 (2013.01); C09J 167/00 (2013.01); C09J 175/02 (2013.01); C09J 183/04 (2013.01); C08K 2201/005 (2013.01); C09J 2421/00 (2013.01); C09J 2433/00 (2013.01); C09J 2467/00 (2013.01); C09J 2475/00 (2013.01); C09J 2483/00 (2013.01);
Abstract
Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.