The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
May. 08, 2020
Applicant:
Mitsubishi Chemical Corporation, Tokyo, JP;
Inventors:
Shintaro Usui, Tokyo, JP;
Minako Ikeshita, Tokyo, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/28 (2006.01); C08L 23/06 (2006.01); C08L 23/12 (2006.01); C08L 23/20 (2006.01); B32B 27/32 (2006.01); C08K 5/101 (2006.01); B32B 27/30 (2006.01); C08L 23/08 (2006.01);
U.S. Cl.
CPC ...
C08L 23/0846 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); C08K 5/101 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 23/20 (2013.01); B32B 2439/00 (2013.01);
Abstract
A resin composition contains: (A) an ethylene-vinyl alcohol copolymer; (B) an olefin polymer; and (C) a sorbic acid ester; wherein the sorbic acid ester (C) is present in an amount of 0.00001 to 10 ppm based on the weight of the resin composition. The resin composition exhibits reduced susceptibility to coloration.
Usui, Shintaro. (2023). Resin composition, melt-forming material, multilayer structure, and liquid packaging material (U.S. Patent No. 11661502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11661502
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile