The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Jun. 20, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Chie Chikara, Kyotanabe, JP;

Assignee:

KYOCERA Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C08K 5/03 (2006.01); B32B 15/085 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); C08K 3/36 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08K 5/03 (2013.01); B32B 15/085 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/325 (2013.01); C08K 3/36 (2013.01); H05K 1/0373 (2013.01); B32B 2250/03 (2013.01); B32B 2250/40 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/3065 (2013.01); B32B 2457/08 (2013.01); H05K 2201/012 (2013.01);
Abstract

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.


Find Patent Forward Citations

Loading…