The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Jul. 22, 2020
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Keisuke Oku, Minami-ashigara, JP;

Koju Ito, Minami-ashigara, JP;

Hiroshi Yabu, Sendai, JP;

Yoshiaki Uchida, Toyonaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/28 (2006.01); B01F 23/41 (2022.01); C08J 9/26 (2006.01);
U.S. Cl.
CPC ...
C08J 9/26 (2013.01); C08J 9/0004 (2013.01); C08J 9/283 (2013.01); B01F 23/4141 (2022.01); C08J 2201/028 (2013.01);
Abstract

A molded body is produced from a molding material including a continuous phase and a dispersed phase by a three-dimensionalization step, a curing step, and a peeling step. The continuous phase of the molding material is a water phase containing a curable compound. In the three-dimensionalization step, the molding material is placed in a container. In the curing step, the curable compound is cured to form a cured product after the three-dimensionalization step. In the peeling step, the container and the cured product are separated after the curing step. In the dispersed phase removal step, the dispersed phase of the cured product is removed after the curing step.


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