The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
May. 22, 2021
Magic Leap, Inc., Plantation, FL (US);
Steven Alexander-Boyd Hickman, Seattle, WA (US);
Sarah Colline McQuaide, Seattle, WA (US);
Abhijith Rajiv, Seattle, WA (US);
Brian T. Schowengerdt, Seattle, WA (US);
Charles David Melville, Camano Island, WA (US);
Magic Leap, Inc., Plantation, FL (US);
Abstract
A method for fabricating a cantilever having a device surface, a tapered surface, and an end region includes providing a semiconductor substrate having a first side and a second side opposite to the first side and etching a predetermined portion of the second side to form a plurality of recesses in the second side. Each of the plurality of recesses comprises an etch termination surface. The method also includes anisotropically etching the etch termination surface to form the tapered surface of the cantilever and etching a predetermined portion of the device surface to release the end region of the cantilever.