The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Sep. 07, 2021
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Kaveh Adib, Corning, NY (US);
Robert Alan Bellman, Ithaca, NY (US);
Assignee:
Corning Incorporated, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 7/06 (2019.01); C03C 17/30 (2006.01); C03C 27/10 (2006.01); B32B 17/06 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10798 (2013.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); B32B 17/10036 (2013.01); B32B 37/1018 (2013.01); C03C 17/30 (2013.01); C03C 27/10 (2013.01); B32B 2307/714 (2013.01); B32B 2307/748 (2013.01); B32B 2457/206 (2013.01); C03C 2218/33 (2013.01);
Abstract
Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.