The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Dec. 23, 2019
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Fang Dai, Troy, MI (US);

Mei Cai, Bloomfield Hills, MI (US);

Fan Xu, Oakland Township, MI (US);

Tao Wang, Oakland Township, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/658 (2014.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); B32B 5/02 (2006.01); B32B 19/04 (2006.01); C08G 77/04 (2006.01); B32B 27/12 (2006.01); H01M 50/24 (2021.01); H01G 11/78 (2013.01); C08L 83/04 (2006.01); H01G 11/18 (2013.01); C08G 77/20 (2006.01); C08J 3/24 (2006.01);
U.S. Cl.
CPC ...
B32B 7/12 (2013.01); B32B 5/024 (2013.01); B32B 15/14 (2013.01); B32B 19/041 (2013.01); B32B 27/12 (2013.01); C08G 77/04 (2013.01); C08L 83/04 (2013.01); H01G 11/18 (2013.01); H01G 11/78 (2013.01); H01M 10/658 (2015.04); H01M 50/24 (2021.01); C08G 77/20 (2013.01); C08J 3/24 (2013.01); Y02E 60/10 (2013.01);
Abstract

A thermal insulation component according to various aspects of the present disclosure includes a matrix, a crosslinking precursor, and a crosslinking initiator. The matrix includes a thermal insulation material having a thermal conductivity of less than or equal to about 5 W/mK. The crosslinking precursor is embedded in the matrix. The crosslinking precursor includes at least one of an acrylate functional group or a methacrylate functional group. The crosslinking initiator is embedded in the matrix. The crosslinking initiator is configured to decompose to initiate crosslinking of the crosslinking precursor. In certain aspects, the present disclosure also provides an electronics assembly including an electronic component and a thermal insulation material in thermal communication with the electronic component. In certain aspects, the present disclosure also provides methods of manufacturing the thermal insulation component.


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