The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Aug. 21, 2020
Applicant:

Nagase Chemtex Corporation, Osaka, JP;

Inventor:

Yosuke Oi, Tatsuno, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/14 (2006.01); C08K 7/18 (2006.01); B29C 43/00 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01); B29K 105/00 (2006.01); B29K 509/08 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B29C 43/146 (2013.01); B29C 43/003 (2013.01); C08K 7/18 (2013.01); B29C 2043/147 (2013.01); B29C 2795/002 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0005 (2013.01); B29K 2105/0094 (2013.01); B29K 2105/16 (2013.01); B29K 2509/08 (2013.01); B29L 2031/3406 (2013.01);
Abstract

A method of producing a sealed structure, the method including: preparing a substrate and a curable resin composition in a liquid form; and sealing the substrate with the curable resin composition, to form a sealed body including the substrate and a cured product of the curable resin composition. The sealing step includes: printing the curable resin composition onto the substrate, to cover the substrate with a first coating film of the curable resin composition; and compression-molding the first coating film and the substrate together using a mold, with a pressing surface of the mold abut against the first coating film, to convert the first coating film into a second coating film. A ratio of a projected area S1 of the first coating film onto the substrate to a projected area S2 of the second coating film onto the substrate: S1/S2 is 0.9 or more.


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