The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Aug. 16, 2018
Applicant:

Pragmatic Printing Ltd., Sedgefield, GB;

Inventors:

Richard Price, Sedgefield Durham, GB;

Stephen Devenport, Sedgefield Durham, GB;

Brian Cobb, Sedgefield Durham, GB;

Assignee:

PRAGMATIC PRINTING LTD., Sedgefield, GB;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); H05K 3/36 (2006.01); B29C 65/14 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4632 (2013.01); H05K 3/361 (2013.01); B29C 65/1403 (2013.01); B29L 2031/3425 (2013.01);
Abstract

One exemplary aspect relates to a process and apparatus for selectively changing adhesion strength between a flexible substrate and a carrier at specific locations to facilitate shipping and subsequent removal of the flexible substrate from the carrier. The process includes providing a flexible substrate comprising a plurality of integrated circuits thereon providing a carrier for the flexible substrate and adhering the flexible substrate to the carrier by creating an interface between the flexible substrate and the carrier. The process further includes changing the adhesion force between the flexible substrate and the carrier at selected locations by non-uniform treatment of the interface between the flexible substrate and the carrier with an electromagnetic radiation source (e.g. a laser, flashlamp, high powered LED, an infrared radiation source or the like) so as to decrease or increase the adhesion force between a portion of the flexible substrate and the carrier at the selected location.


Find Patent Forward Citations

Loading…