The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Sep. 10, 2021
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); G01P 3/44 (2006.01); G01P 15/18 (2013.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); G01P 3/44 (2013.01); G01P 15/125 (2013.01); G01P 15/18 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10757 (2013.01);
Abstract
An electronic device includes: a substrate having an upper surface and a lower surface; a first electronic component mounted on the upper surface of the substrate; a second electronic component mounted on the lower surface of the substrate; and a mold portion covering the second electronic component without covering the first electronic component. The first electronic component is bonded to the upper surface on the first relative surface via a conductive first bonding member. The second electronic component is bonded to the lower surface via a second bonding member on a second relative surface relative to the lower surface.