The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jul. 23, 2021
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Daiki Yanagishima, Kyoto, JP;

Toshiyuki Ishikawa, Kyoto, JP;

Hirotaka Takihara, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/691 (2006.01); H03K 17/61 (2006.01); H04L 25/02 (2006.01); G01R 31/27 (2006.01); G01R 31/28 (2006.01); H02P 31/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/691 (2013.01); G01R 31/27 (2013.01); G01R 31/2884 (2013.01); H02P 31/00 (2013.01); H03K 17/61 (2013.01); H04L 25/028 (2013.01);
Abstract

A signal transmission device includes a signal transmission chip, and a first lead frame supporting the signal transmission chip. A first inductor spiral ring is on a surface of the signal transmission chip, a second inductor spiral ring is inside the signal transmission chip, a first bonding pad is electrically coupled between the first and second inductor spiral rings, a guard ring covers the first and second inductor spiral rings in a plan view, and bonding pads are outside of the guard ring. A direction of rotation between the first and second inductor spiral rings are different from each other. The signal transmission device further includes a semiconductor chip and a second lead frame supporting the semiconductor chip, wherein the signal transmission chip and the semiconductor chip face each other.


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