The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Apr. 25, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunjin Kim, Seoul, KR;

Byungchul Kim, Seongnam-si, KR;

Jungmin Park, Seoul, KR;

Kwanghyun Baek, Hwaseong-si, KR;

Youngju Lee, Seoul, KR;

Jungyub Lee, Yongin-si, KR;

Sungchul Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H01Q 1/24 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01); H05K 7/14 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); H01Q 1/24 (2013.01); H05K 1/0243 (2013.01); H05K 1/0277 (2013.01); H05K 5/0017 (2013.01); H05K 5/0086 (2013.01); H05K 7/1427 (2013.01); H05K 9/0024 (2013.01);
Abstract

Disclosed is an electronic device having a space formed between front and rear surfaces thereof, the electronic device comprising: a first cover arranged on the front surface; a second cover arranged on the rear surface; a frame surrounding the first cover and the second cover; and a multilayered circuit board coupled to the second cover so as to constitute the housing of the electronic device, wherein the multilayered circuit board may comprises an insulated metal layer having a surface coupled to the second cover and a substrate-structured antenna device having a surface coupled to the insulated metal layer.


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