The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Mar. 05, 2021
Applicant:

Seoul Viosys Co., Ltd., Gyeonggi-do, KR;

Inventors:

Ji Hoon Park, Gyeonggi-do, KR;

Ji Hun Kang, Gyeonggi-do, KR;

Chae Hon Kim, Gyeonggi-do, KR;

Yong Hyun Baek, Gyeonggi-do, KR;

Hyo Shik Choi, Gyeonggi-do, KR;

Assignee:

Seoul Viosys Co., Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 22/20 (2013.01);
Abstract

A method of fabricating a light emitting device includes (i) determining whether each measurement location is defective or not based on a measurement result of the emission wavelength of each location, (ii) forming a test stacked structure by combining one of the first wafers, one of the second wafers, and one of the third wafers in a set of wafers, and (iii) calculating a combination yield of the test stacked structure based on a count of defective measurement locations that overlap in the test stacked structure.


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