The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jul. 07, 2021
Applicant:

Imec Vzw, Leuven, BE;

Inventor:

Abhitosh Vais, Heverlee, BE;

Assignee:

Imec VZW, Leuven, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/737 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0817 (2013.01); H01L 29/66242 (2013.01); H01L 29/737 (2013.01);
Abstract

The present disclosure provides an HBT that includes (i) a semiconductor support layer; at least four wall structures side-by-side on the support layer; (iii) a semiconductor collector-material ridge structure disposed on the support layer between two adjacent wall structures of the at least four wall structures; (iv) a semiconductor base-material layer, wherein a first part of the base-material layer is disposed on a first region of the ridge structure and a second part of the base-material layer is disposed across the wall structures, wherein the base-material layer is supported by the wall structures; (v) a semiconductor emitter-material layer disposed on the first part of the base-material layer; (vi) a base contact layer disposed on the second part of the base-material layer; an emitter contact layer disposed on the emitter-material layer; and (viii) a collector contact layer disposed on a second region of the ridge structure.


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