The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jun. 26, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Youngchul Lee, Hwaseong-si, KR;

Taesang Park, Seoul, KR;

Kyoree Lee, Suwon-si, KR;

Tackmo Lee, Suwon-si, KR;

Gyun Heo, Suwon-si, KR;

Youngjun Moon, Hwaseong-si, KR;

Won Choi, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 25/16 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/0095 (2013.01); H01L 33/62 (2013.01); H01L 33/0093 (2020.05); H01L 33/52 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.


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