The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Feb. 24, 2021
Applicant:
Fujitsu Limited, Kawasaki, JP;
Inventor:
Kenichi Kawai, Yokohama, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); G06F 30/394 (2020.01); H01L 23/64 (2006.01); G06F 115/12 (2020.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G06F 30/394 (2020.01); H01L 23/642 (2013.01); H05K 1/181 (2013.01); G06F 2115/12 (2020.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01);
Abstract
An electronic device includes: a board that includes an insulating film, a wiring layer and a via provided in the insulating film, and a plurality of power source pads and a plurality of ground pads which are provided in the insulating film so as to surround a capacitor region in which a capacitor is provided and to which a plurality of bumps is coupled; and an electronic component that is mounted at the board, and is electrically coupled to the plurality of power source pads and the plurality of ground pads through the wiring layer and the via. Further, a method for supporting design of the electronic device is provided.