The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Sep. 23, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sungil Choi, Hwaseong-si, KR;
Hyeondong Song, Suwon-si, KR;
Myeongshik Shim, Hwaseong-si, KR;
Jonghyun Hong, Hwaseong-si, KR;
Bonggyo Seo, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Abstract
A wafer chuck includes a body portion; a vacuum barrier portion including a wall structure arranged at the same distance from a center point of the body portion; f protrusions arranged inside and outside the vacuum barrier portion, protruding from a top surface of the body portion and spaced apart from each other; and a vacuum portion including vacuum holes spaced apart from each other penetrating the body portion inside the vacuum barrier portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile