The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jun. 23, 2021
Applicant:

Western Digital Technologies, Inc., San Jose, CA (US);

Inventors:

Teruhiro Nakamiya, Setagaya-ku, JP;

Kazuhiro Nagaoka, Fujisawa, JP;

Satoshi Nakamura, Yokohama, JP;

Nobuyuki Okunaga, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); G11B 5/596 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G11B 5/486 (2013.01); G11B 5/4846 (2013.01); G11B 5/59605 (2013.01); H05K 1/0201 (2013.01); H05K 1/0209 (2013.01);
Abstract

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a thermally-conductive stiffener, at least one wiring layer over the stiffener, and a cover film over the at least one wiring layer, where the centroid of the stiffener is offset from the centerline of the cover film. Thus, utilizing the heat-sink characteristics of the stiffener, temperature differences among the upper and lower electrical pads of the FPC resulting from a heat-based interconnection procedure can be reduced and the temperatures across the FPC finger made more uniform, damage to the FPC prevented, and soldering yields improved.


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