The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Apr. 22, 2021
Sensel, Inc., Sunnyvale, CA (US);
John Aaron Zarraga, San Francisco, CA (US);
Alexander Meagher Grau, Durham, NC (US);
Bethany Noel Haniger, Los Gatos, CA (US);
Bradley James Bozarth, Moore, SC (US);
Brogan Carl Miller, Mountain View, CA (US);
Ilya Daniel Rosenberg, Mountain View, CA (US);
James Frank Thomas, Danville, CA (US);
Mark Joshua Rosenberg, Sunnyvale, CA (US);
Peter Hans Nyboer, San Jose, CA (US);
Reuben Eric Martinez, Gilroy, CA (US);
Scott Gregory Isaacson, Mountain View, CA (US);
Stephanie Jeanne Oberg, Sunnyvale, CA (US);
Timothy James Miller, Half Moon Bay, CA (US);
Tomer Moscovich, San Francisco, CA (US);
Yibo Yu, Santa Clara, CA (US);
SENSEL, INC., Sunnyvale, CA (US);
Abstract
The present invention relates to interpolated variable impedance touch sensor arrays for force-aware large-surface device interaction. An exemplary system for detecting a continuous pressure curve includes a plurality of physical variable impedance array (VIA) columns connected by interlinked impedance columns and a plurality of physical VIA rows connected by interlinked impedance rows. The system also includes a plurality of column drive sources connected to the interlinked impedance columns and to the plurality of physical VIA columns through the interlinked impedance columns as well as a plurality of row sense sinks connected to the interlinked impedance rows and to the plurality of physical VIA rows through the interlinked impedance rows. Further, the system includes a processor configured to interpolate the continuous pressure curve in the physical VIA columns and physical VIA rows from an electrical signal from the plurality of column drive sources sensed at the plurality of row sense sinks.