The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Apr. 21, 2017
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Bernhard Herlfterkamp, Bottrop, DE;
Eckhard Puerkner, Duesseldorf, DE;
Andy Swain, Chesham, GB;
Wolfgang Klingberg, Korschenbroich, DE;
Marcel Huebenthal, Haan, DE;
Mario Eckers, Wegberg, DE;
Stefan Strenger, Essen, DE;
Julia Thomas, Wokingham, GB;
Oliver Klewe, Langenfeld, DE;
Kevin Mills, High Wycombe, GB;
Alexander Caspers, Moenchengladbach, DE;
Michael Schroettle, Neuss, DE;
George Easdown, Church Crookham, GB;
Assignee:
HENKEL AG & CO., KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 123/02 (2006.01); C09J 5/00 (2006.01); B32B 1/02 (2006.01); B32B 7/12 (2006.01); B65D 65/42 (2006.01); B32B 27/32 (2006.01); B32B 37/12 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B65D 85/00 (2006.01); B32B 27/08 (2006.01); C08L 23/02 (2006.01); C08L 23/20 (2006.01); C09J 7/21 (2018.01); C09J 7/24 (2018.01); C09J 7/35 (2018.01);
U.S. Cl.
CPC ...
C09J 123/02 (2013.01); B32B 1/02 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 37/1207 (2013.01); B65D 65/42 (2013.01); B65D 85/70 (2013.01); C08L 23/02 (2013.01); C08L 23/20 (2013.01); C09J 5/00 (2013.01); C09J 7/21 (2018.01); C09J 7/243 (2018.01); C09J 7/35 (2018.01); B32B 2037/1215 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2323/04 (2013.01); B32B 2323/10 (2013.01); B32B 2439/46 (2013.01); C08L 2205/025 (2013.01); C09J 2423/00 (2013.01); C09J 2423/046 (2013.01); C09J 2423/106 (2013.01);
Abstract
A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises