The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Nov. 06, 2018
Applicant:

Dow Toray Co., Ltd., Tokyo, JP;

Inventor:

Makoto Yoshitake, Ichihara, JP;

Assignee:

DOW TORAY CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/04 (2006.01); C09D 7/63 (2018.01); C09D 183/04 (2006.01); C09J 11/06 (2006.01); C09J 183/04 (2006.01);
U.S. Cl.
CPC ...
C08L 83/04 (2013.01); C09D 7/63 (2018.01); C09D 183/04 (2013.01); C09J 11/06 (2013.01); C09J 183/04 (2013.01);
Abstract

Provided is a hydrosilylation reactive composition and a method for producing a semi-cured product and a cured product using the hydrosilylation reactive composition, which exhibit sharp curability during the reaction while maintaining pot life and can provide a molecular design through the reaction control of the Munit/Dunit. The composition comprises: (A) a compound containing at least one monovalent hydrocarbon group having an aliphatic unsaturated bond per molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms per molecule; (C) a first hydrosilylation catalyst; and (D) a second hydrosilylation catalyst which microencapsulates component (C) with a thermoplastic resin having a softening point within the temperature range of 50 to 200° C. and exhibits activity at temperatures higher than that of component (C). Also provided is a method for carrying out a hydrosilylation reaction at temperatures of two stages using the composition.


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