logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11655363 B1

PDFFull Text
Date of Patent:
May. 23, 2023

Filed:

Dec. 18, 2019

Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same

Applicant:

Samsung Sdi Co., Ltd., Yongin-si, KR;

Inventors:

Sang Jin Kim, Suwon-si, KR;

Sang Kyun Kim, Suwon-si, KR;

Tae Shin Eom, Suwon-si, KR;

Dong Hwan Lee, Suwon-si, KR;

Young Joon Lee, Suwon-si, KR;

Yong Han Cho, Suwon-si, KR;

Assignee:

SAMSUNG SDI CO., LTD., Yongin-si, KR;

Attorney:

Lee IP Law, P.C.

Primary Examiner:

Edward J Cain

Int. Cl.
CPC ...
C08L 83/00 (2006.01); C08L 63/00 (2006.01); B29B 9/08 (2006.01); B29B 9/12 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); C08J 3/22 (2006.01); H01L 25/065 (2023.01); B29K 63/00 (2006.01); B29K 509/02 (2006.01); B29C 43/00 (2006.01); B29K 105/00 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); B29B 9/08 (2013.01); B29B 9/12 (2013.01); C08J 3/226 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); B29C 43/003 (2013.01); B29K 2063/00 (2013.01); B29K 2105/251 (2013.01); B29K 2509/02 (2013.01); B29K 2995/0013 (2013.01); C08L 2203/206 (2013.01); C08L 2205/025 (2013.01); C08L 2310/00 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/0655 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01);
Abstract

A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.

Find Patent Forward Citations

Loading…