The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jan. 16, 2020
Applicant:

Melexis Technologies NV, Tessenderlo, BE;

Inventor:
Assignee:

MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81C 99/00 (2010.01); B81B 7/00 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0051 (2013.01); B81C 1/00325 (2013.01); G01L 9/0072 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/098 (2013.01); B81C 1/0046 (2013.01); B81C 2203/0154 (2013.01);
Abstract

A method of manufacturing a sensor device comprising: configuring a moulding support structure and a packaging mould so as to provide predetermined pathways to accommodate a moulding compound, the moulding support structure defining a first notional volume adjacent a second notional volume. An elongate sensor element and the moulding support structure are configured so that the moulding support structure fixedly carries the elongate sensor element and the elongate sensor element resides substantially in the first notional volume and extends towards the second notional volume, the elongate sensor element having an electrical contact electrically coupled to another electrical contact disposed within the second notional volume. The moulding support structure carrying () the elongate sensor element is disposed within the packaging mould (). The moulding compound is then introduced () into the packaging mould during a predetermined period of time () so that the moulding compound fills the predetermined pathways, thereby filling the second notional volume and surrounding the elongate sensor element within the second notional volume without contacting the elongate sensor element.


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