The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Nov. 12, 2021
Applicant:
Fujimori Kogyo Co., Ltd., Tokyo, JP;
Inventors:
Hajime Okamoto, Tokyo, JP;
Hidekazu Furukawa, Tokyo, JP;
Takeo Matsuyama, Tokyo, JP;
Toyoaki Suzuki, Tokyo, JP;
Assignee:
FUJIMORI KOGYO CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/08 (2006.01); B65D 65/40 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/38 (2006.01); B65D 75/32 (2006.01);
U.S. Cl.
CPC ...
B65D 65/40 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/32 (2013.01); B32B 27/38 (2013.01); B65D 75/32 (2013.01); B32B 2250/03 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7246 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01);
Abstract
A laminate has a substrate layer, an intermediate layer, and a fluorine-based resin layer in this order, and has a total film thickness of 400 μm or less, in which a thickness of the intermediate layer is 5 μm or more and 50 μm or less, and an upper yield point stress of the laminate is 1,500 N/cmor more.