The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jul. 30, 2021
Applicant:

Mighty Buildings, Inc., San Francisco, CA (US);

Inventors:

Stanislav Gudkov, Moscow, RU;

Aleksei Dubov, San Mateo, CA (US);

Evgeniy Ostanin, Moscow, RU;

Assignee:

Mighty Buildings, Inc., San Francisco, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/106 (2017.01); G01L 5/1627 (2020.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/106 (2017.08); G01L 5/1627 (2020.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12);
Abstract

Systems and methods for monitoring stress in 3D-printed building structures using embedded and surface sensors. The sensors may be embedded during or after the 3D printing process. The sensors may be strain gauges integrally formed in the 3D-printed building structure or positioned on the surface of the 3D-printed building structure. The embedded and surface sensors may measure tensile and compressive deformation occurring during the printing process, material relaxation process, the transportation process, and at a final location of the 3D-printed building structure. Deformation data collected by the sensors may be compared to accepted threshold values based on the material of the 3D-printed building structure.


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