The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Nov. 29, 2017
Applicant:

Ecole Polytechnique Federale DE Lausanne (Epfl), Lausanne, CH;

Inventors:

Nicolas Vachicouras, Chambesy, CH;

Christina Myra Tringides, Ames, IA (US);

Stephanie P. Lacour, Etoy, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 15/08 (2006.01); B29C 59/00 (2006.01); H01B 13/00 (2006.01); B29C 55/02 (2006.01); B29C 55/10 (2006.01); B29D 28/00 (2006.01); B29K 79/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/007 (2013.01); B29C 55/023 (2013.01); B29C 55/10 (2013.01); B29D 28/00 (2013.01); B32B 3/266 (2013.01); B32B 15/08 (2013.01); H01B 13/0036 (2013.01); B29K 2079/08 (2013.01); B32B 2307/202 (2013.01);
Abstract

The present disclosure relates to how to engineer reversible elasticity in thin films and/or layers and/or substrates, using a repeated Y-shaped motif, which is cut out through the film and/or layer and/or substrate. As an example, using a 75 μm thick polyimide (PI) foil, macroscopic dog-bone shaped structures with a range of geometrical parameters of the Y shape have been prepared according to an embodiment of the present disclosure. The tensile strain response of the film at its point of fracture was then recorded. The structures were also confirmed using finite element modeling. Upon stretching, the PI ligaments locally deflect out of plane, allowing the foil to macroscopically stretch.


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