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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11653455 B1

PDFFull Text
Date of Patent:
May. 16, 2023

Filed:

Feb. 26, 2021

Electroplating edge connector pins of printed circuit boards without using tie bars

Applicant:

Nvidia Corporation, Santa Clara, CA (US);

Inventors:

Mingyi Yu, Saratoga, CA (US);

Gregory Patrick Bodi, Santa Cruz, CA (US);

Assignee:

NVIDIA Corporation, Santa Clara, CA (US);

Attorney:

Artegis Law Group, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/24 (2006.01); H05K 3/40 (2006.01); H05K 3/44 (2006.01); H05K 3/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/242 (2013.01); H05K 1/117 (2013.01); H05K 3/0047 (2013.01); H05K 3/043 (2013.01); H05K 2201/0347 (2013.01);
Abstract

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

Find Patent Forward Citations

Yu, Mingyi. (2023). Electroplating edge connector pins of printed circuit boards without using tie bars (U.S. Patent No. 11653455). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11653455

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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