The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Aug. 30, 2021
Applicants:

Sumitomo Electric Printed Circuits, Inc., Shiga, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Kohei Okamoto, Shiga, JP;

Kousuke Miura, Shiga, JP;

Hiroshi Ueda, Shiga, JP;

Shoichiro Sakai, Osaka, JP;

Maki Ikebe, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); H05K 1/0296 (2013.01); H05K 3/241 (2013.01); H05K 3/244 (2013.01); H05K 2201/0347 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μn or greater to smaller than 8.5 μm.


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