The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Mar. 19, 2020
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo-to, JP;
Inventors:
Naoko Okimoto, Tokyo-to, JP;
Mitsutaka Nagae, Tokyo-to, JP;
Kenichi Ogawa, Tokyo-to, JP;
Makiko Sakata, Tokyo-to, JP;
Toru Miyoshi, Tokyo-to, JP;
Assignee:
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0133 (2013.01); H05K 2201/0162 (2013.01);
Abstract
A wiring board includes a substrate including a first surface and a second surface located on an opposite side to the first surface, where the substrate has stretchability, an interconnection wire located adjacent to the first surface of the substrate, and a stress relaxation layer located between the first surface of the substrate and the interconnection wire, where the stress relaxation layer has a modulus of elasticity lower than that of the substrate.