The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Dec. 03, 2019
Applicant:
Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka, JP;
Inventors:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Osaka, JP;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/0215 (2013.01); H05K 1/09 (2013.01); H05K 9/0064 (2013.01); H05K 2201/0715 (2013.01);
Abstract
Provided is a ground member that can prevent damage to interlayer adhesion between a conductive layer and an adhesive layer of the ground member due to heating in producing a shielded printed wiring board or in mounting an electronic component on a shielded printed wiring board. The ground member of the present invention includes: a conductive layer; and an adhesive layer stacked on the conductive layer, the adhesive layer containing a binder component and hard particles, the adhesive layer having a thickness of 5 to 30 μm.