The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Sep. 18, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Myunghee Kim, Suwon-si, KR;
Donghwan Kim, Suwon-si, KR;
Sungwook Kim, Suwon-si, KR;
Yong Namkung, Suwon-si, KR;
Jenghun Suh, Suwon-si, KR;
Jaephil Shim, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 25/0753 (2013.01); H01L 33/0093 (2020.05); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/58 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29244 (2013.01); H01L 2224/29255 (2013.01); H01L 2224/29263 (2013.01); H01L 2224/29269 (2013.01); H01L 2224/29287 (2013.01); H01L 2224/29293 (2013.01); H01L 2224/83894 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A display module and a manufacturing method thereof are provided. The manufacturing method may include forming an epitaxial film comprising a light emitting layer, a first type semiconductor layer, and a second type semiconductor layer, attaching the epitaxial film to an intermediate substrate comprising a conductive material, patterning the epitaxial film to form a light emitting diode (LED) and coupling the LED to a driving circuit layer through the conductive material.