The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Dec. 23, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Darryl Becker, Rochester, MN (US);

Mark J. Jeanson, Rochester, MN (US);

Gerald Bartley, Rochester, MN (US);

Matthew Doyle, Chatfield, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H01G 4/30 (2006.01); H01G 4/232 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/58 (2013.01); H05K 1/0243 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01);
Abstract

A method of attaching an integrated circuit (IC) package to a printed circuit board (PCB) with a set of direct current (DC) blocking capacitors includes: applying a conductive attachment material to a first set of attachment pads located on a first planar surface of the IC package; aligning the set of DC blocking capacitors in accordance with corresponding positions of the first set of attachment pads; attaching the set of DC blocking capacitors to the IC package by: positioning the aligned set of DC blocking capacitors so that a first surface of a first DC blocking capacitor of the set of DC blocking capacitors is adjacent to a corresponding attachment pad of the first set of attachment pads; and connecting the conductive attachment material to the IC package and to the first surface of the first DC blocking capacitor to create an IC package assembly.


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