The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
May. 25, 2021
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Keitaro Ichikawa, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49555 (2013.01); H01L 21/4842 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/3735 (2013.01); H01L 23/49503 (2013.01); H01L 23/49562 (2013.01); H01L 24/45 (2013.01); H01L 24/46 (2013.01); H01L 24/49 (2013.01); H01L 2924/13055 (2013.01); H02P 27/08 (2013.01);
Abstract
Inner leads having die pads having upper surfaces to which semiconductor elements are mounted each have a stepped profile, and surfaces of portions of the inner leads are exposed from a sealing resin in plan view. Outer leads connected to the inner leads have first bends at side surfaces of the sealing resin to extend in a direction on a side of the upper surfaces of the die pads, so that a miniaturized semiconductor device can be obtained.