The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Jun. 24, 2020
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Kishore N. Renjan, Singapore, SG;

Bilal Mohamed Ibrahim Kani, Singapore, SG;

Kyusang Kim, Singapore, SG;

Manoj Vadeentavida, Singapore, SG;

Pierpaolo Lupo, Singapore, SG;

Prashanth S. Holenarsipur, Los Altos, CA (US);

Praveesh Chandran, Singapore, SG;

Vinodh Babu, Singapore, SG;

Yuta Kuboyama, San Mateo, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/3121 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/48135 (2013.01);
Abstract

Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.


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