The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Aug. 31, 2021
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Il Ro Lee, Suwon-si, KR;
Jung Min Kim, Suwon-si, KR;
Hong Je Choi, Suwon-si, KR;
Sang Wook Lee, Suwon-si, KR;
Seon Ho Park, Suwon-si, KR;
Jeong Ryeol Kim, Suwon-si, KR;
Bon Seok Koo, Suwon-si, KR;
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Abstract
A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including CuSn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including CuSn; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 μm.