The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Aug. 09, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Lei Wang, Beijing, CN;

Haisheng Wang, Beijing, CN;

Yingming Liu, Beijing, CN;

Xiaoliang Ding, Beijing, CN;

Lijun Zhao, Beijing, CN;

Yuzhen Guo, Beijing, CN;

Xiaoquan Hai, Beijing, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06V 40/13 (2022.01); H01L 27/32 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1318 (2022.01); H01L 27/3234 (2013.01); H01L 27/3244 (2013.01); H01L 51/5253 (2013.01); H01L 51/5275 (2013.01); H01L 51/56 (2013.01); H01L 27/14678 (2013.01); H01L 2227/323 (2013.01);
Abstract

The disclosure provides a fingerprint identification panel. The fingerprint identification panel includes an encapsulation layer, a light emitting element, a light sensing element and a dielectric layer. The light emitting element and the light sensing element are on a same side of the encapsulation layer, and the encapsulation layer is configured to enable light emitted from the light emitting element to be totally reflected in the encapsulation layer; the dielectric layer is between the encapsulation layer and the light sensing element and in direct contact with the encapsulation layer, and is configured to enable the light totally reflected by the encapsulation layer to be received by the light sensing element after passing through the dielectric layer, and a refractive index of the dielectric layer is smaller than that of the encapsulation layer.


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