The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Dec. 10, 2018
Applicant:
Samco Inc., Kyoto, JP;
Inventors:
Risa Funahashi, Kyoto, JP;
Taichi Hashimoto, Kyoto, JP;
Hirokazu Terai, Koka, JP;
Fumina Miyake, Kyoto, JP;
Assignee:
SAMCO INC., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/327 (2006.01); B32B 15/085 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/327 (2013.01); B32B 15/085 (2013.01); B32B 38/0008 (2013.01);
Abstract
A method for bonding a first member having a first bond-target surface made of cycloolefin polymer to a second member having a second bond-target surface made of metal. The method includes a process of exposing the first bond-target surface and the second bond-target surface to at least one of the HO plasma and Oplasma, as well as a process of combining the first bond-target surface and the second bond-target surface.