The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Dec. 24, 2018
Applicant:

Byd Company Limited, Shenzhen, CN;

Inventors:

Qing Gong, Shenzhen, CN;

Qiang Guo, Shenzhen, CN;

Mengde Wang, Shenzhen, CN;

Wei An, Shenzhen, CN;

Assignee:

BYD COMPANY LIMITED, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/05 (2006.01); C22C 30/02 (2006.01); B22D 17/00 (2006.01); C22C 1/02 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
C22C 9/05 (2013.01); B22D 17/007 (2013.01); C22C 1/02 (2013.01); C22C 30/02 (2013.01); H04M 1/026 (2013.01);
Abstract

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.


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