The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
May. 07, 2021
Hyundai Motor Company, Seoul, KR;
Kia Corporation, Seoul, KR;
Chang-Wook Lee, Anyang-si, KR;
Yeon-Jung Hwang, Seoul, KR;
HYUNDAI MOTOR COMPANY, Seoul, KR;
KIA CORPORATION, Seoul, KR;
Abstract
A hot stamping component and a manufacturing method thereof include: (a) preparing a blank including 0.27 to 0.33 wt % of carbon (C), more than 0 and 0.40 wt % or less of silicon (Si), 1.10 to 1.60 wt % of manganese (Mn), more than 0 and 0.030 wt % or less of phosphorus (P), more than 0 and 0.015 wt % or less of sulfur (S), 0.10 to 0.60 wt % of chromium (Cr), more than 0 and 0.1 wt % or less of titanium (Ti), and 0.0008 to 0.0050 wt % of boron (B); (b) heat-treating the blank; and (c) molding the heat-treated blank and cooling the molded blank. The component and method may stably provide high strength by minimizing hydrogen charging in a hot stamping manufacturing process and preventing hydrogen delayed fracture due to the hydrogen charging.