The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Mar. 03, 2021
Applicant:

HT Materials Corporation, Clifton Park, NY (US);

Inventor:

YiFeng Wang, Clifton Park, NY (US);

Assignee:

HT MATERIALS CORPORATION, Clifton Park, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/06 (2006.01); C08K 7/14 (2006.01); C08L 79/04 (2006.01); C08K 3/04 (2006.01); C08K 7/06 (2006.01);
U.S. Cl.
CPC ...
C08G 73/0677 (2013.01); C08K 3/042 (2017.05); C08K 7/06 (2013.01); C08K 7/14 (2013.01); C08L 79/04 (2013.01);
Abstract

Compositions and methods for semicrystalline poly(aryl ether ketone) copolymers incorporating 2-benzimidazolinone and hydroquinone as comonomer units with 4,4'-dihalobenzophenone, and compositions and methods for semicrystalline poly(aryl ether ketone) copolymers incorporating 2-benzimidazolinone and hydroquinone as comonomer units with 1,4-bis(4-dihalobenzoyl)benzene are described herein. The copolymers have advantageous properties, particularly in terms of their glass transition temperatures (T), crystallization temperatures from melt (T), melting temperatures (T), crystallinity and chemical resistance. The copolymers are suitable for manufacturing high temperature and chemical resistance molded systems and other articles of manufacture via injection molding, extrusion, compression molding, thermoforming and additive manufacturing.


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