The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Oct. 29, 2015
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Kristopher J. Erickson, Palo Alto, CA (US);

Thomas Anthony, Palo Alto, CA (US);

Howard S. Tom, Palo Alto, CA (US);

Sivapackia Ganapathiappan, Palo Alto, CA (US);

Lihua Zhao, Palo Alto, CA (US);

Krzysztof Nauka, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/00 (2017.01); B29C 64/165 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B29C 67/00 (2017.01); C09B 47/06 (2006.01); C09B 47/24 (2006.01); C09B 47/067 (2006.01); B33Y 40/00 (2020.01); B29C 64/40 (2017.01); B29C 64/176 (2017.01); B29C 64/10 (2017.01); B29C 64/182 (2017.01); B33Y 99/00 (2015.01); B29C 64/25 (2017.01); B33Y 40/10 (2020.01); B33Y 50/00 (2015.01); B29C 64/205 (2017.01); B29C 64/307 (2017.01); B29C 64/245 (2017.01); B33Y 40/20 (2020.01); B29C 64/255 (2017.01); B29C 64/30 (2017.01); B29C 64/227 (2017.01); B22F 10/28 (2021.01); B22F 10/50 (2021.01); B33Y 30/00 (2015.01); B29C 64/20 (2017.01); B29C 64/393 (2017.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B22F 10/28 (2021.01); B22F 10/50 (2021.01); B29C 64/00 (2017.08); B29C 64/10 (2017.08); B29C 64/176 (2017.08); B29C 64/182 (2017.08); B29C 64/20 (2017.08); B29C 64/205 (2017.08); B29C 64/227 (2017.08); B29C 64/245 (2017.08); B29C 64/25 (2017.08); B29C 64/255 (2017.08); B29C 64/30 (2017.08); B29C 64/307 (2017.08); B29C 64/393 (2017.08); B29C 64/40 (2017.08); B29C 67/00 (2013.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 40/00 (2014.12); B33Y 40/10 (2020.01); B33Y 40/20 (2020.01); B33Y 50/00 (2014.12); B33Y 50/02 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B33Y 99/00 (2014.12); C09B 47/065 (2013.01); C09B 47/0678 (2013.01); C09B 47/24 (2013.01); B22F 2999/00 (2013.01); G03G 2215/2054 (2013.01); G05B 2219/49023 (2013.01); G05B 2219/49246 (2013.01); Y10T 156/1722 (2015.01); Y10T 156/1798 (2015.01);
Abstract

In an example of a method for forming three-dimensional (3D) printed electronics, a build material is applied. A fusing agent is selectively applied on at least a portion of the build material. The build material is exposed to radiation and the portion of the build material in contact with the fusing agent fuses to form a layer. An electronic agent is selectively applied on at least a portion of the layer, which imparts an electronic property to the at least the portion of the layer.


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