The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
May. 08, 2020
Gecko Robotics, Inc., Pittsburgh, PA (US);
Edward A. Bryner, Pittsburgh, PA (US);
Kevin Y. Low, Pittsburgh, PA (US);
Joshua D. Moore, Pittsburgh, PA (US);
Dillon R. Jourde, Pittsburgh, PA (US);
Edwin H. Cho, Pittsburgh, PA (US);
William J. Pridgen, Pittsburgh, PA (US);
Domenic P. Rodriguez, Pittsburgh, PA (US);
Jeffrey J. Mrkonich, Pittsburgh, PA (US);
Mark Cho, Pittsburgh, PA (US);
Francesco H. Trogu, Pittsburgh, PA (US);
Benjamin A. Guise, Pittsburgh, PA (US);
Todd Joslin, Wexford, PA (US);
Logan A. MacKenzie, Penn Hills, PA (US);
Ian Miller, Aspinwall, PA (US);
Alexander C. Watt, Pittsburgh, PA (US);
Gecko Robotics, Inc., Pittsburgh, PA (US);
Abstract
Systems, methods, and apparatus for tracking location of an inspection robot are disclosed. An example apparatus for tracking inspection data may include an inspection chassis having a plurality of inspection sensors configured to interrogate an inspection surface, a first drive module and a second drive module, both coupled to the inspection chassis. The first and second drive module may each include a passive encoder wheel and a non-contact sensor positioned in proximity to the passive encoder wheel, wherein the non-contact sensor provides a movement value corresponding to the first passive encoder wheel. An inspection position circuit may determine a relative position of the inspection chassis in response to the movement values from the first and second drive modules.