The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Jul. 14, 2015
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Jacques Gollier, Redmond, WA (US);

Garrett Andrew Piech, Corning, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/00 (2014.01); B23K 26/067 (2006.01); B23K 26/073 (2006.01); C03B 33/02 (2006.01); G02B 5/00 (2006.01); G02B 27/09 (2006.01); B23K 26/06 (2014.01); G02B 7/10 (2021.01); B23K 103/00 (2006.01); G02B 7/14 (2021.01);
U.S. Cl.
CPC ...
B23K 26/0006 (2013.01); B23K 26/0613 (2013.01); B23K 26/0648 (2013.01); B23K 26/0676 (2013.01); B23K 26/0732 (2013.01); B23K 26/0734 (2013.01); B23K 26/0738 (2013.01); C03B 33/0222 (2013.01); G02B 5/001 (2013.01); G02B 7/10 (2013.01); G02B 27/095 (2013.01); G02B 27/0911 (2013.01); G02B 27/0927 (2013.01); G02B 27/0977 (2013.01); B23K 2103/54 (2018.08); G02B 7/14 (2013.01);
Abstract

A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (') disposed within an optical path of the pulsed laser beam. The optical assembly (′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.


Find Patent Forward Citations

Loading…