The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Nov. 28, 2018
Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Brent Elliot, Cupertino, CA (US);

Guleid Hussen, San Francisco, CA (US);

Jason Stephens, San Francisco, CA (US);

Michael Parker, Brentwood, CA (US);

Alfred Grant Elliot, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23B 9/00 (2006.01); C04B 35/581 (2006.01); B23K 1/19 (2006.01); B23K 35/28 (2006.01); C04B 37/00 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B32B 9/00 (2006.01); H01L 21/67 (2006.01); B23K 1/008 (2006.01); C04B 37/02 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 1/19 (2013.01); B23K 35/286 (2013.01); B32B 9/005 (2013.01); C04B 35/581 (2013.01); C04B 37/005 (2013.01); C04B 37/026 (2013.01); H01L 21/67126 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); B23K 2103/52 (2018.08); C04B 2235/6581 (2013.01); C04B 2237/123 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/68 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/80 (2013.01); C04B 2237/84 (2013.01);
Abstract

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with Nickel and an alloying element, under controlled atmosphere. The completed joint will be fully or substantially Nickel with another element in solution. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck. Semiconductor processing equipment comprising ceramic and joined with a nickel alloy and adapted to withstand processing chemistries, such as fluorine chemistries, as well as high temperatures.


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