The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Oct. 19, 2021
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Robert A. Stevenson, Canyon Country, CA (US);

Christine A. Frysz, Orchard Park, NY (US);

Richard L. Brendel, Carson City, NV (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/375 (2006.01); A61N 1/08 (2006.01); H01G 4/35 (2006.01); A61N 1/37 (2006.01); H05K 9/00 (2006.01); H03H 1/00 (2006.01); H05K 5/00 (2006.01); H01R 13/7195 (2011.01); H03H 7/01 (2006.01); H01G 4/06 (2006.01); H01G 4/40 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/08 (2013.01); A61N 1/086 (2017.08); A61N 1/375 (2013.01); A61N 1/3718 (2013.01); H01G 4/35 (2013.01); H03H 1/0007 (2013.01); H01G 4/06 (2013.01); H01G 4/40 (2013.01); H01R 13/7195 (2013.01); H03H 7/1766 (2013.01); H03H 2001/0042 (2013.01); H03H 2001/0085 (2013.01); H05K 1/181 (2013.01); H05K 5/0095 (2013.01); H05K 9/00 (2013.01); H05K 999/99 (2013.01); H05K 2201/10015 (2013.01);
Abstract

An EMI/energy dissipating filter for an active implantable medical device (AIMD) comprises a first gold braze sealing an insulator to the ferrule of a glass-to-metal seal (GTMS) and a lead wire that is sealed in a passageway through the insulator by a second gold braze. A circuit board is disposed adjacent to the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization connected to its active electrode plates and a ground end metallization connected to its ground electrode plates. A ground electrical path extends from the ground end metallization of the chip capacitor, through a circuit board ground plate disposed on or within the circuit board, and to the ferrule. An active electrical path extends from the active end metallization of the chip capacitor to the lead wire of the GTMS.


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