The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 16, 2023

Filed:

Aug. 17, 2021
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Junichiro Fujimagari, Kanagawa, JP;

Tomohiro Ohkubo, Kumamoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/00 (2006.01); H01L 23/00 (2006.01); H01L 27/146 (2006.01); H04N 5/369 (2011.01); A61B 1/05 (2006.01); B60R 11/04 (2006.01); G05D 1/02 (2020.01);
U.S. Cl.
CPC ...
A61B 1/000095 (2022.02); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 27/1462 (2013.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14623 (2013.01); H01L 27/14634 (2013.01); H01L 27/14643 (2013.01); H01L 27/14685 (2013.01); H04N 5/369 (2013.01); A61B 1/05 (2013.01); B60R 11/04 (2013.01); G05D 1/0231 (2013.01); H01L 2224/16147 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01);
Abstract

The present technology relates to a solid-state image pickup element, electronic equipment, and a semiconductor apparatus that make it possible to reduce a surface reflection in an area in which a slit is formed and improve flare characteristics. A solid-state image pickup element includes a pixel area in which a plurality of pixels is two-dimensionally arranged in a matrix, a chip mounting area in which a chip is flip-chip mounted, and a dam area that is arranged around the chip mounting area and in which one or more slits that block an outflow of a resin are formed. In the dam area, the same OCL as that in the pixel area is formed. The present technology can be applied to a solid-state image pickup element etc. in which a chip is flip-chip mounted, for example.


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