The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2023

Filed:

Sep. 27, 2021
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Yiying Jian, Dongguan, CN;

Dingfang Li, Dongguan, CN;

Xinhu Gong, Shenzhen, CN;

Gaoliang Xia, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20418 (2013.01); H05K 7/20718 (2013.01);
Abstract

The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.


Find Patent Forward Citations

Jian, Yiying. (2023). Heat dissipation apparatus and server (U.S. Patent No. 11647608). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11647608

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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