IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11647594 B1

PDFFull Text
Date of Patent:
May. 09, 2023

Filed:

Oct. 16, 2020

Method for curing solder paste on a thermally fragile substrate

Applicant:

Ncc Nano, Llc, Dallas, TX (US);

Inventor:

Rob Jacob Hendriks, Eindhoven, NL;

Assignee:

PulseForge, Inc., Austin, TX (US);

Attorneys:

Antony P. Ng

Russell Ng PLLC

Primary Examiner:

A Dexter Tugbang

Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 1/005 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); B23K 1/00 (2006.01); H05K 3/12 (2006.01); B23K 101/42 (2006.01); B23K 103/00 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 1/005 (2013.01); B23K 1/0016 (2013.01); H05K 3/0082 (2013.01); H05K 3/10 (2013.01); H05K 3/12 (2013.01); H05K 3/1216 (2013.01); H05K 3/3452 (2013.01); H05K 3/3478 (2013.01); H05K 3/3489 (2013.01); B23K 2101/42 (2018.08); B23K 2103/40 (2018.08); B23K 2103/42 (2018.08); H01L 24/82 (2013.01); H05K 1/0274 (2013.01); H05K 3/02 (2013.01); H05K 3/125 (2013.01); H05K 2201/0112 (2013.01); H05K 2201/2054 (2013.01); H05K 2203/107 (2013.01);
Abstract

A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Find Patent Forward Citations

Loading…