The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2023
Filed:
Jul. 01, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Hideyuki Hara, Hitachinaka, JP;
Takuro Kanazawa, Hitachinaka, JP;
Narutoshi Yamada, Hitachinaka, JP;
HITACHI ASTEMO, LTD., Hitachinaka, JP;
Abstract
A circuit substrate () is provided with first and second rigid parts () having six metal foil layers, and a thin flexible part () having two metal foil layers connecting the two rigid parts. A ground wiring () which is shaped like a wide strip is formed on the surface metal foil layer, and a plurality of inter-rigid-part wirings () are formed on the inner metal foil layer in parallel lines. Outer edges () of the ground wiring () are positioned closer to side edges () of the flexible part () than to the inter-rigid-part wirings (). The ground wiring () protects the inter-rigid-part wirings () from cracks.